Maximize Your Impact At Device Packaging Conference 2026
Device Packaging Conference 2026, taking place March 2–5 at the Sheraton Grand at Wild Horse Pass in Chandler, Arizona, is a cornerstone event for professionals in semiconductor packaging, advanced materials, and electronic assembly. It gathers a specialized community of engineers, R&D leaders, and senior-level technical decision-makers who influence product development pipelines and vendor selection strategies.
This event goes beyond technical sessions—it’s where manufacturing roadmaps are validated, key supplier relationships are initiated, and technology partners are assessed for capabilities and alignment. Attendees include directors and VPs of engineering, operations, and product groups from market-leading chipmakers, OEMs, and materials providers. Connecting ahead of time allows your team to identify which attendees are evaluating new tooling, materials integration platforms, or ATE solutions and to secure time with those shaping both budgets and technology adoption paths.
Vendelux gives your team access to enriched attendee data, offering a detailed and strategic view of who will be onsite—so you can move from passive exhibiting to meaningful relationship-building with the right stakeholders.
How Sales, Marketing and Revops Teams Can Use This Attendee List
At a technically focused event like Device Packaging Conference 2026, attendees are not browsing casually—they’re preparing for capital expenditures, roadmap decisions, and vendor evaluations. Vendelux’s enriched conference attendee list helps your team reach the right contacts early and efficiently.
Sales teams can segment prospects by company type—such as semiconductor manufacturers, substrate suppliers, or assembly equipment firms—and filter further by role level to focus on engineering directors, procurement executives, or process leads. Marketing can tailor messaging to align with specific pain points: thermal management, device miniaturization, or yield optimization. Outreach can reference technology trends being discussed in sessions, giving credibility and relevance to every message.
By identifying budget holders and technical specifiers ahead of time, your outreach has a higher chance of converting into scheduled meetings. Onsite, your reps already know who’s attending and where business priorities align. After the event, use the attendee data to provide content follow-ups based on session topics or shared areas of interest, reinforcing the conversation and moving it forward.
This level of data gives your team a significant advantage in how to get more meetings and drive real business interactions—not just badge scans.
Timing Is Everything
Device Packaging Conference 2026 runs from March 2 to March 5, 2026. With many attendees planning their calendars weeks in advance, it’s essential to initiate outreach by late Q4 2025 or early January 2026 to be considered for meetings during the event.
Using Vendelux, your team can identify the right prospects early and begin message sequencing aligned to session agendas, investment windows, or platform evaluations. Align your marketing and outreach plans with the attendee list release timeline and stay ahead of booking requests, especially for priority accounts.
Early engagement ensures your brand is already familiar when attendees enter the venue—making on-site conversations more impactful and outcomes more measurable.
What’s Included In The Device Packaging Conference 2026 Attendee List?
Vendelux provides clear visibility into the executives expected to attend Device Packaging Conference 2026 using a mix of organizer disclosures and predictive intelligence. Clients can upload a list of target companies to quickly identify overlaps and decision-makers within the attendee base.
The enriched attendee list includes first and last names, job titles, company names, company websites, locations (city, state, country), LinkedIn profiles, verified work email addresses, and phone numbers where available—delivering a high-confidence foundation for pre-event outreach, onsite engagement, and post-show follow-ups.
Where Is Device Packaging Conference 2026?
The event will take place at the Sheraton Grand at Wild Horse Pass in Chandler, Arizona, United States.
When Is Device Packaging Conference 2026?
Device Packaging Conference 2026 is scheduled for March 2–5, 2026.
What Type Of Event Is Device Packaging Conference 2026?
Device Packaging Conference 2026 is a technical and business-focused conference dedicated to microelectronics packaging, advanced device integration, and materials innovation. The program includes keynotes, paper presentations, panel discussions, and networking sessions tailored to professionals in manufacturing, R&D, and engineering leadership.
How Many People Attend Device Packaging Conference 2026?
The event is expected to draw over 700 attendees from a mix of global semiconductor firms, research institutions, and advanced materials suppliers. The audience includes senior-level engineers, CTOs, business unit leaders, and operational decision-makers—all with influence over capital deployment and technology partnerships.
