Maximize Your Impact At IC & Sensor Packaging Expo 2026
IC & Sensor Packaging Expo 2026, set for January 21 at Tokyo Big Sight in Tokyo, Japan, is a high-value event focused on the future of semiconductor packaging, sensors, and related microelectronics. As a key date on the global electronics manufacturing calendar, the expo draws senior engineers, R&D leaders, procurement heads, and product development specialists from major OEMs, component suppliers, and contract manufacturers across Asia and beyond.
This is where critical decisions are made around supplier partnerships, innovation sourcing, and technology integration for next-generation sensor applications. Attendees hold budgetary authority, influence product design lifecycles, and shape manufacturing ecosystem strategies. For companies selling into automotive, industrial automation, medical devices, and consumer electronics markets, engaging early with these engineering-driven buyers is essential.
With Vendelux’s enriched attendee list, sales and marketing teams can identify high-value prospects aligned by geography, solution type, and buying intent. Use this data to prioritize outreach, connect with decision-makers before the show, and approach the event with greater clarity and confidence.
How Sales, Marketing and Revops Teams Can Use This Attendee List
For teams focused on B2B hardware, components, or software aligned to electronics manufacturing and packaging, the IC & Sensor Packaging Expo 2026 attendee list from Vendelux provides a direct path to those controlling specification decisions and supplier selection.
Use attendee data to segment contacts by technical function or product line—such as MEMS engineers, systems architects, or sourcing managers—and customize outreach to their vertical priorities, whether automotive-grade sensor reliability or consumer device miniaturization timelines.
Secure meetings in advance with verified decision-makers responsible for evaluating packaging platforms and supplier technologies. From there, convert on-site conversations into structured post-show opportunities with scoped proposals, application briefs, or collaboration trials.
Following the event, use enriched contact profiles to target attendees with relevant updates and product roadmaps based on their stated use cases or sectors of interest. This improves follow-up effectiveness and helps drive meaningful pipeline growth from your conference participation.
Timing Is Everything
IC & Sensor Packaging Expo 2026 takes place on January 21, 2026. For sales and revenue teams, that places significant importance on Q4 outreach and engagement planning.
Use Vendelux’s attendee data as early as Q3 2025 to align your messaging with the engineering calendars and buying cycles of your target accounts. The earlier you identify your matches in the attendee list, the more time you’ll have to schedule meetings and shape meaningful interactions.
High-priority decision-makers often build their meetings calendar well before the expo floor opens. Time your outbound strategies based on when travel budgets are approved and exploratory conversations are launched, not just the event start date.
What’s Included In The IC & Sensor Packaging Expo 2026 Attendee List?
Vendelux provides visibility into executives expected to attend IC & Sensor Packaging Expo 2026 using both organizer-sourced data and predictive insights on industry participation. Clients can upload a list of priority accounts to surface matches within the broader attendee base.
The enriched attendee list includes first and last names, job titles, company names, company websites, attendee city, state, and country, LinkedIn profile links, verified business email addresses, and phone numbers where available.
Where Is IC & Sensor Packaging Expo 2026?
The event will be held at Tokyo Big Sight in Tokyo, Tōkyō-to, Japan.
When Is IC & Sensor Packaging Expo 2026?
IC & Sensor Packaging Expo 2026 is scheduled for January 21, 2026.
What Type Of Event Is IC & Sensor Packaging Expo 2026?
IC & Sensor Packaging Expo 2026 is a focused industry exhibition designed for professionals in the semiconductor, sensor, and electronic packaging ecosystem. The event includes product showcases, technical sessions, and networking opportunities for engineers, procurement leaders, and technology innovators from across the global electronics supply chain.
How Many People Attend IC & Sensor Packaging Expo 2026?
The event is expected to host more than 20,000 attendees, primarily from Japan and neighboring countries, including senior engineers, technology decision-makers, R&D heads, and procurement professionals from OEMs and supply partners.
