Maximize Your Impact At IC & Sensor Packaging Expo 2026
IC & Sensor Packaging Expo 2026, taking place January 21 at Tokyo Big Sight in Tokyo, Japan, is a pivotal event for professionals across the semiconductor, sensor tech, and electronics manufacturing sectors. This expo is known for attracting product heads, engineering executives, supply chain leaders, and decision-makers from OEMs, component manufacturers, and packaging solution providers.
With attendees evaluating partnerships, procurement options, and long-term supplier relationships, this event plays a direct role in next-generation product integration and vendor strategy. Many companies finalize budgets and vendor shortlists leading into the expo. That makes early engagement critical for businesses looking to influence or align with 2026 planning cycles.
Using Vendelux’s enriched conference attendee list, your team gains advanced visibility into who’s attending, what they’re responsible for, and where they are in the buying process. Knowing how to connect with the right people — before they walk the show floor — allows your team to shape conversations earlier and drive stronger ROI from every interaction.
How Sales, Marketing and Revops Teams Can Use This Attendee List
Engagement at IC & Sensor Packaging Expo 2026 hinges on connecting with the right technical, procurement, and executive stakeholders ahead of time. The enriched conference attendee list helps teams segment by engineering function, technical leadership, supply chain roles, or region so outreach can be targeted and relevant.
Sales teams can use attendee data to identify verified budget owners — those leading sourcing or vendor evaluations — and schedule briefings before the event. Marketing teams can personalize messaging around design cycle needs, component compatibility, or integration timelines based on company profile. For RevOps teams, aligning sales cadences to event timing allows for maximum conversion on the ground.
The enriched list also equips teams to initiate meaningful on-site conversations, then follow up based on specific use cases or R&D priorities uncovered in person. Whether you’re targeting new customers or expanding into existing accounts, this list helps you get more meetings and convert conference attendees into long-term relationships.
Timing Is Everything
IC & Sensor Packaging Expo 2026 will be held on January 21, 2026. In an industry where product planning and component selection happen quarters in advance, getting a head start on outreach before this event is key.
Vendelux lets teams align messaging to the right contacts well before the expo date. Early access to attendee insights means you can coordinate pre-event meetings, tailor materials in advance, and reduce time-to-engagement once on-site. In a technical environment like semiconductor packaging, timing and specificity matter — and early engagement can be the difference between getting shortlisted or overlooked.
What’s Included In The IC & Sensor Packaging Expo 2026 Attendee List?
Vendelux provides visibility into executives and professionals expected to attend IC & Sensor Packaging Expo 2026 using organizer data along with predictive insights. Clients can also upload a list of their target accounts to see which prospects are expected to be in attendance.
The enriched attendee list includes first and last name, job title, company name, company website, location (city, state, country), LinkedIn profile, verified email addresses, and phone numbers where available.
Where Is IC & Sensor Packaging Expo 2026?
The event will be held at Tokyo Big Sight in Tokyo, Tōkyō-to, Japan.
When Is IC & Sensor Packaging Expo 2026?
IC & Sensor Packaging Expo 2026 is scheduled for January 21, 2026.
What Type Of Event Is IC & Sensor Packaging Expo 2026?
IC & Sensor Packaging Expo 2026 is an industry-specific expo focused on IC packaging, sensor integration, and semiconductor manufacturing technologies. The event features technical demonstrations, exhibitor showcases, speaking sessions, and networking opportunities for R&D experts, product teams, and supply chain decision-makers.
How Many People Attend IC & Sensor Packaging Expo 2026?
The event is expected to attract several thousand attendees from across key manufacturing regions in Asia, North America, and Europe. Audience members typically include senior engineers, sourcing leads, project managers, and executives from electronics, semiconductor, and systems integration companies.
